METHOD FOR MICROPACKAGING OF ELECTRICAL OR ELECTROMECHANICAL DEVICES AND MICROPACKAGE

摘要

A micropackage, an interposer, in which a flexible dielectric plastic substrate composed of a dielectric layer with a layer of conductive film (copper) on one surface is photo-imaged to define at least two electrical interconnects each including a tab formed in the copper film. The interconnects extend out over the edges of the plastic substrate in at least two directions to form at least two flanges. A cavity is formed in the plastic substrate such that the tabs of the at least two interconnects extend into said cavity. An electrical device or an electro mechanical device having contacts is received in the cavity of the plastic substrate with its contacts engaged with and bonded to the tabs of the interconnects. The method of making, and the use of the interposer in a further substrate, e.g. a PCB, that contains electrical connections or circuitry to which the interposer is connected to by the flanges.