A coated conductive particle is disclosed which is composed of a metal-coated particle and a thermoplastic resin layer strongly bonded to a metal layer of the particle. The thermoplastic resin layer of this coated conductive particle is not dissolved in a solvent, and is not melted when heated. A coated conductive particle (5) comprises a base fine particle (1), a metal coating layer (2) applied onto the base fine particle (1), and a resin layer (3) which is formed on the metal coating layer (2) and composed of a thermoplastic polymer. The thermoplastic polymer is chemically bonded with an organic compound introduced in the metal coating layer (2).
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