Provided is a die-attaching paste composition having reduced elastic modulus, and increased water resistance and oxidative stability, and therefore showing improved mechanical strength and decreased thermal deformation, which improves reliability of a semiconductor package product. The die-attaching paste composition comprises 50 to 70 % by weight of liquid or solid epoxy, 3 to 10 % by weight of acrylate and 25 to 40 % by weight of a flexing agent, wherein the die-attaching paste composition further comprises 1 to 7 % of a UV initiator and 5 to 30 % of a hydrogenated nitrile rubber(HNBR) on the basis of the total weight of the die-attaching paste composition. In the hydrogenated nitrile rubber(HNBR), acrylonitrile contained therein has a content of 15 to 50 % on the basis of the total weight of the hydrogenated nitrile rubber(HNBR).
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