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Sawing device for e.g. quartz electronic component, has wires moving alternately or continuously to press against fixed saw piece, maintaining device arranged such that sawing gap width is kept constant during sawing of chips
Sawing device for e.g. quartz electronic component, has wires moving alternately or continuously to press against fixed saw piece, maintaining device arranged such that sawing gap width is kept constant during sawing of chips
The device has a wire strand maintained in position by a groove provided on a surface of cylindrical guides. Wires move alternately or continuously to press against a fixed saw piece (17) on a support table (18). A maintaining device (22) maintains partially or fully sawed chips (23) in parallel. The device is arranged such that widths of sawing gaps (24) are kept approximately constant during sawing of chips by wire.
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