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Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB
Distance arrangement method e.g. for components on assembly area of circuit board, involves applying three-dimensional printing in environment of component hole on assembly surface of PCB
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机译:距离排列方法对于电路板组装区域上的组件,涉及在PCB组装表面上的组件孔环境中进行三维打印
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摘要
The method involves applying a three-dimensional printing on in the environment of a component hole on an assembly surface of a PCB. Equipment of an element, such as an electrolytic capacitor, is provided inserting into the component into a hole in such a way that the element body is separated by a distance by three-dimensional printing of the assembly surface.
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