Integrated semiconductor memory e.g. dynamic RAM, for use in multi-chip package, has temperature measuring unit which is controlled so that measuring frequency changes as function of processing of temperature measurements values

摘要

The memory (10) has a temperature measuring unit (1) which performs a temperature measurement during the operation of the memory, where the measurement is repeated for several time periods. The time periods correspond to the measuring frequency of the temperature measuring unit. The unit is controlled such that the measuring frequency changes as a function of the temporal processing of the values of the repeated temperature measurements. An independent claim is also included for a method for operating an integrated semiconductor memory.