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Device for positioning electrode for electroplating moving substrate including nonparallel connecting elements for electroplating printed circuit boards (PCB) on horizontal electroplating machine has elements in high capacity polypropylene
Device for positioning electrode for electroplating moving substrate including nonparallel connecting elements for electroplating printed circuit boards (PCB) on horizontal electroplating machine has elements in high capacity polypropylene
Device for positioning an electrode for electroplating a moving substrate, including first and second connecting elements connected to first and second sides of an end, where the connecting elements are not parallel to each other. An independent claim is included for an electroplating machine including the device.
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