首页> 外国专利> Device for positioning electrode for electroplating moving substrate including nonparallel connecting elements for electroplating printed circuit boards (PCB) on horizontal electroplating machine has elements in high capacity polypropylene

Device for positioning electrode for electroplating moving substrate including nonparallel connecting elements for electroplating printed circuit boards (PCB) on horizontal electroplating machine has elements in high capacity polypropylene

机译:用于在水平电镀机上电镀用于印刷移动基板的电极的定位装置,包括用于电镀印刷电路板(PCB)的非平行连接元件,该元件具有高容量的聚丙烯

摘要

Device for positioning an electrode for electroplating a moving substrate, including first and second connecting elements connected to first and second sides of an end, where the connecting elements are not parallel to each other. An independent claim is included for an electroplating machine including the device.
机译:用于定位用于电镀移动基板的电极的装置,包括连接至一端的第一侧和第二侧的第一连接元件和第二连接元件,其中连接元件彼此不平行。对于包括该装置的电镀机包括独立权利要求。

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