POLICE CARRIERS, POLICE MACHINERY, POLICE MACHINERY PROCEDURES, DICKEN OR ENDPUNKT MEASUREMENT PROCEDURES FOR POLICED SKILLS, MANUFACTURING A HALF-LIGHT EXECUTIVE

摘要

After a hole is formed in the polishing pad 21, a transparent window plate 31 is inserted into this hole. Here, a gap a is left between the upper surface of the transparent window plate 31 and the outermost surface constituting the working surface of the polishing pad 21. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad 21 and transparent window plate 31 are compressed. In this case, Äthe system isÜ arranged so that the gap a remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate 31 is recessed from the upper surface of the polishing pad 21, there is no scratching of the surface of the transparent window plate 31 during dressing. Accordingly, the polishing pad has a long useful life. IMAGE