Sub-micrometric suspended object, e.g. tension bar, manufacturing method for fabricating, e.g., chip, involves etching assembly formed by masks, transfer and recess layers to hollow out recess layer part so that objects are suspended

摘要

The method involves producing sub-micrometric objects (38) on a transfer layer and making hard masks on a part of the layer for delimiting an area comprising a part of the objects. An assembly formed by the masks, the layer and a recess layer are etched to eliminate the masks and the transfer layer`s part and to hollow out a part of the recess layer situated under the area such that the objects are suspended. The speed of the etching of the recess layer is greater than the etching speed of the transfer layer and the hard masks. An independent claim is also included for a microelectronic component manufactured according to a sub-micrometric object manufacturing method.