首页> 外国专利> Pb-FREE Sn-BASED MATERIAL, AND CONDUCTOR FOR ELECTRIC WIRING, TERMINAL-CONNECTING SECTION AND Pb-FREE SOLDER ALLOY

Pb-FREE Sn-BASED MATERIAL, AND CONDUCTOR FOR ELECTRIC WIRING, TERMINAL-CONNECTING SECTION AND Pb-FREE SOLDER ALLOY

机译:无铅锡基材料,以及用于电线,端子连接段和无铅焊料合金的导体

摘要

PPROBLEM TO BE SOLVED: To provide a Pb-free Sn-based material which hardly forms whiskers on the surface of the Pb-free Sn-based material part: a conductor for electric wiring; a terminal-connecting section; and a Pb-free solder alloy. PSOLUTION: The conductor for electric wiring has the Pb-free Sn-based material part at least in one part of the surface, and is manufactured by using a base metal for the Sn-based material part, which includes at least one element selected from Sb, Bi, Cd, In, Ag, Au, Ni, Ti, Zr and Hf as a transformation-delaying element, and at least one element selected from Ge, P, Zn, K, Cr, Mn, Na, V, Si, Al, Li, Mg and Ca as an oxidization-inhibiting element respectively, and subjecting it to reflow treatment. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:提供一种在无铅锡基材料部件的表面上几乎不形成晶须的无铅锡基材料。端子连接部;和无铅焊料合金。

解决方案:电线用导体至少在表面的一部分具有无铅的Sn基材料部分,并通过使用贱金属来制造Sn基材料部分,其中至少包括一种选自Sb,Bi,Cd,In,Ag,Au,Ni,Ti,Zr和Hf的元素作为转变延迟元素,以及选自Ge,P,Zn,K,Cr,Mn,Na的至少一种元素, V,Si,Al,Li,Mg和Ca分别作为氧化抑制元素,并对其进行回流处理。

版权:(C)2008,日本特许厅&INPIT

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