METHOD AND DEVICE FOR ELIMINATING RESIDUAL SOLDER USING CIRCULAR ARC SURFACE OR ELLIPTICAL ARC SURFACE-LIKE SOLDERING IRON

摘要

PROBLEM TO BE SOLVED: To provide a method and device for easily eliminating large volume of solder remaining on a substrate pattern surface after dismounting an electronic component having a lot of lead terminals such as an IC, etc. soldered to a printed board.;SOLUTION: The solder remaining on the substrate surface is easily removed by using an iron processed into a circular arc surface or an elliptical arc surface shape and a solder wick.;COPYRIGHT: (C)2008,JPO&INPIT