PROBLEM TO BE SOLVED: To provide a laminate low in dielectric loss tangent, reducing the effect of temperature and humidity on the dielectric loss tangent and hard to cause the peeling due to the occurrence of a blister or the like, and an electric circuit board including the laminate.;SOLUTION: The laminate is obtained by a method wherein a polymerizable composition containing a cycloolefin monomer, a metathesis polymerization catalyst, a chain transfer agent and a crosslinking agent is cast on a support and subjected to bulk metathesis polymerization to obtain a film-like molded body, a conductive wiring layer is laminated on the surface of the molded body by plating or the like and an amorphous carbon film is subsequently laminated on the wiring layer. Many laminates are superposed one upon another to obtain the electric circuit board.;COPYRIGHT: (C)2004,JPO&NCIPI
展开▼
