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INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING WAFER LEVEL SPACER
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING WAFER LEVEL SPACER
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机译:集成晶圆包装系统,包括晶圆级间隔器
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摘要
An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.
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