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Micro-optoelectromechanical system packages for a light modulator and methods of making the same

机译:用于光调制器的微光机电系统封装及其制造方法

摘要

A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid, gel or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.
机译:用于光调制器的微光机电系统(MOEMS)封装包括密封的调制器封装,该密封的调制器封装包含密封在第一透明盖下方的光调制器;包含密封的调制器包装的较大的次级包装,所述次级包装包括密封件和第二透明盖;光学材料设置在第一透明盖和第二透明盖之间,所述光学材料为固体,凝胶或液体。一种用于光调制器的可替代的微光机电系统(MOEMS)封装,包括密封的调制器封装,该密封的调制器封装包含密封在第一透明盖下的光调制器。包含密封调制器包装的次级大包装;干燥剂或吸气剂材料与调制器包装一起置于次级包装内。

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