BONDED CHIP ASSEMBLY WITH A MICRO-MOVER FOR MICROELECTROMECHANICAL SYSTEMS

摘要

An embodiment of a micro-mover in accordance with the present invention can include a movable plate hermetically sealed between a top cap wafer and a bottom cap wafer. A magnet disposed on one or both of the cap wafers. The movable plate can include current paths disposed within a magnetic field generated by the magnet, and coaxially with a surface of the movable plate. When current is applied to the current paths, the movable plate is urged some distance within a gap between the movable plate and a stationary portion disposed co-planar with the movable plate.