SYSTEM AND METHOD FOR INSPECT PRINTED CIRCUIT BOARD ASSEMBLY USING INFRARED THERMOGRAPHY

摘要

A system and a method for inspecting a pair of printed circuit board assemblies using an infrared thermography are provided to collectively inspect whether or not electronic components are mounted, whether or not a soldering abutment has an error, and whether or not the electronic components are normally operated. A system for inspecting a pair of printed circuit board assemblies(1a,1b) includes first to fourth chambers(10,20,30,40), a temperature equalizing unit, a heating unit, a temperature image acquiring unit, a controller(41), and an image processing unit(43). The PCB assembly sequentially passes through the first to the fourth chambers. The temperature equalizing unit is installed in the first chamber, and equalizes and maintains the temperature of the PCB assembly disposed in the first chamber. The heating unit equally heats a rear surface of the PCB assembly disposed at an inspection position after transferring the PCB assembly from the first chamber in the second chamber. The temperature image acquiring unit measures the temperature distribution for a front surface of the PCB assembly in the second chamber to provide the temperature distribution as a temperature image. The temperature equalizing unit is installed in the third chamber, and equalizes and maintains the temperature of the PCB assembly transferred from the second chamber.