首页> 外国专利> PRINTED CIRCUIT BOARD, PCB CARD USING THE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD AND THE PCB CARD

PRINTED CIRCUIT BOARD, PCB CARD USING THE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD AND THE PCB CARD

机译:印刷电路板,使用该印刷电路板的印刷电路板卡,制造印刷电路板的方法和印刷电路板卡

摘要

A PCB(Printed Circuit Board), a PCB card using the PCB, and methods for manufacturing the PCB and the PCB card are provided to simplify manufacturing processes of the PCB and the PCB card and to reduce a limit rate of a memory chip mounted on the PCB. A PCB card(500) includes a PCB basic member(120), at least one contact unit(130), a circuit pattern(140), at least one semiconductor element(310), and a sealing member(400). The one contact unit is formed so that a surface thereof is exposed to a region of the PCB basic member. The circuit pattern is formed on a surface of the PCB basic member so that a part thereof is electrically connected to the contact unit. At least one semiconductor element is mounted to be electrically conducted to the circuit pattern. The sealing member is formed to isolate the circuit pattern and the semiconductor element from the outside.
机译:提供一种PCB(印刷电路板),使用该PCB的PCB卡以及制造该PCB和PCB卡的方法,以简化PCB和PCB卡的制造工艺并降低安装在其上的存储芯片的极限率。 PCB。 PCB卡(500)包括PCB基本构件(120),至少一个接触单元(130),电路图案(140),至少一个半导体元件(310)和密封构件(400)。形成一个接触单元,使得其表面暴露于PCB基础构件的区域。电路图案形成在PCB基础构件的表面上,使得其一部分电连接至接触单元。至少一个半导体元件被安装为电传导至电路图案。形成密封构件以将电路图案和半导体元件与外部隔离。

著录项

  • 公开/公告号KR20080026436A

    专利类型

  • 公开/公告日2008-03-25

    原文格式PDF

  • 申请/专利权人 LG ELECTRONICS INC.;

    申请/专利号KR20060091448

  • 发明设计人 LEE KWANG TAE;LEE SUNG GUE;KANG KYU DONG;

    申请日2006-09-20

  • 分类号H05K3;H01R12;

  • 国家 KR

  • 入库时间 2022-08-21 19:53:58

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