首页> 外国专利> METHOD FOR PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A SUBSTRATE, PRINTED CIRCUIT BOARD, AND SYSTEM COMPRISING A PRINTED CIRCUIT BOARD

METHOD FOR PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A SUBSTRATE, PRINTED CIRCUIT BOARD, AND SYSTEM COMPRISING A PRINTED CIRCUIT BOARD

机译:用激光辅助金属化和基板的印刷,电路板的印刷来提供印刷电路板的方法以及包括印刷电路板的系统

摘要

A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.
机译:通过激光投影对基板的金属面板进行构图,在金属面板上层压介电层,激光照射基板以在基板中形成过孔,激光激活基板上的种皮,从基板上清洗种皮来制造印刷电路基板的未图案化部分,在基板上形成图案化的堆积层,并蚀刻掉形成金属凸起的金属镀层。

著录项

  • 公开/公告号KR20080070877A

    专利类型

  • 公开/公告日2008-07-31

    原文格式PDF

  • 申请/专利权人 INTEL CORP.;

    申请/专利号KR20087015840

  • 发明设计人 SALAMA ISLAM A.;

    申请日2008-06-27

  • 分类号H05K3/10;H05K3/06;

  • 国家 KR

  • 入库时间 2022-08-21 19:53:14

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