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METHOD FOR PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A SUBSTRATE, PRINTED CIRCUIT BOARD, AND SYSTEM COMPRISING A PRINTED CIRCUIT BOARD
METHOD FOR PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A SUBSTRATE, PRINTED CIRCUIT BOARD, AND SYSTEM COMPRISING A PRINTED CIRCUIT BOARD
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机译:用激光辅助金属化和基板的印刷,电路板的印刷来提供印刷电路板的方法以及包括印刷电路板的系统
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摘要
A printed circuit is made by laser projection patterning a metal panel of a substrate, laminating a dielectric layer on the metal panel, laser irradiating the substrate to form vias in the substrate, laser activating a seed coat on the substrate, washing the seed coat from an unpatterned portion of the substrate, forming a patterned build-up layer on the substrate, and etching away a metal plating forming metal protrusions.
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