A METHOD OF DRY FLUXING METAL SURFACES, AN APPARATUS FOR DRY FLUXING METAL SURFACES AND A METHOD OF TREATING A SURFACE

摘要

The present invention process for dry fluxing (dry fluxing) processing a metal surface of one or more components to be treated soldered by electron attachment (electron attachment) using a gas mixture of reducing gas (reducing gas) including hydrogen and deuterium It is a disclosed a method for detecting and correcting, and the method (a) the step of providing one or more components to be treated to be soldered which are connected to the first electrode as a target assembly; (B) the adjacent to the target assembly, providing a second electrode; (C) the step of providing a gas mixture containing reducing gas comprising hydrogen and deuterium between the first electrode and the second electrode; (D) a form a first electrode and the emission current among provides a direct current (DC) voltage electrode between the second electrode and by donating electrons to the reducing gas combined with the ionic reducing gas and deuterium negatively charged to form a hydrogen molecule; And (e) by the target assembly in contact with a negatively charged ionic reducing gas includes the step of reducing the oxides on the target assembly. Further, the present invention discloses also the associated device.