Connection quality test method, involves comparing reflected signals, which are produced in reaction to test signal or generated signals, with two threshold values, where one value differs from other value

摘要

The method involves transmitting test signals by a semiconductor component e.g. data buffer component (5a), where the test signals exhibit test pulses. Reflected signals, which are produced in reaction to the test signal or generated signals, are compared with a threshold value. The reflected signals or the generated signals are compared with another threshold value, where the latter value differs from the former value. The data buffer component is integrated in a memory module. Independent claims are also included for the following: (1) a test device for implementing the test method (2) a semiconductor component with a receiver device (3) a memory module with the semiconductor component.