Memory device for electrical devices, mobile phones and personal digital assistants, has memory pack of stored memory chips, which are displaced in relation to each other

摘要

The memory device (1), has a memory pack (3) of stored memory chips, which are displaced in relation to each other. The memory chip (4) is connected individually with a substrate-pad (6). The substrate-pad is connected with the control circuit. The memory chips connect the stored memory chip parallely with corresponding chip-pads of other stored memory chip of the memory pack with the substrate-pads, which are connected with the control circuit. Independent claims are also included for the following: (1) a flash memory, which has a flash-memory pack of stored flash memory chips, which are displaced in relation to each other (2) a method for manufacturing a memory pack.