METHOD FOR PACKAGING OPTICAL OR OPTOELECTRONIC COMPONENTS, AND OPTICAL OR OPTOELECTRONIC HOUSING ELEMENT MAY BE PRODUCED IN ACCORDANCE WITH THE PROCESS

摘要

A method of producing housing parts for optical or optoelectronic components in which a metal housing element (3) is bonded to a transparent housing element (7) by means of a glass solder ring, the glass solder being brought into contact with the metal and transparent housing members, and the metal housing member being induction heated by an alternating electromagnetic field generated by an induction coil (20), whereby the glass solder is heated and fused in contact with the metal case member and a hermetically sealed, preferably annular, connection between the metal case member and the transparent case member being produced by melting and subsequently solidifying the glass solder.