首页>
外国专利>
EPOXY RESIN COMPOSITION FOR USE IN SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING IT
EPOXY RESIN COMPOSITION FOR USE IN SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING IT
展开▼
机译:用于半导体封装和使用它的半导体器件的环氧树脂组合物
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for use in semiconductor encapsulation which ensures such a flame resistance in a thin-wall molded article as is the basic performance in the semiconductor device and besides which is excellent in the high temperature characteristics and has the higher environmental performance, and to provide a semiconductor device using it.;SOLUTION: The epoxy resin composition has the essential components of an epoxy resin, a hardener and an inorganic filler, and the above hardener shall contain an aminotriazine-type phenol novolac resin expressed by formula (1) (wherein, R1 is hydrogen, a methyl group or a methylphenol group; and R2 is hydrogen, an amino group or an aminomethylphenol group).;COPYRIGHT: (C)2009,JPO&INPIT
展开▼
机译:解决的问题:提供一种用于半导体封装的环氧树脂组合物,该环氧树脂组合物确保薄壁模塑制品中的阻燃性,这是半导体器件的基本性能,此外还具有优异的高温特性并且具有解决方案:环氧树脂组合物具有环氧树脂,固化剂和无机填料的基本成分,并且上述固化剂应包含氨基三嗪型苯酚酚醛清漆树脂由式(1)表示的式(其中,R 1 Sub>是氢,甲基或甲基苯酚基; R 2 Sub>是氢,氨基或氨基甲基苯酚基) 。;版权:(C)2009,日本特许厅和INPIT
展开▼