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The seed coat it leaves clean barleying, the wheat grain which clean barleys

机译:种皮留下干净的大麦,干净的大麦的小麦粒

摘要

PROBLEM TO BE SOLVED: To provide the excellent method for attaining pregelatinized barley polishing by suppressing stickiness and a yield reduction based on feedstock due to crushed grains produced through a series of processes, i.e., pregelatinization, polishing and drying, namely through the total production process for pregelatinized polished barley for eating through mixing and boiling with polished rice, or porous pregelatinized polished barley as a raw material for miso(soybean paste) or shochu(distilled sprit). SOLUTION: This method comprises the following steps: a pre-pregelatinization barley polishing step 2 for polishing raw barley to such an extent as to leave seed skin to obtain barley grains, a water addition step 3 for adding water to the thus polished barley grains to such a water content as to be pregelatinizable to a specified degree, a steaming step 4 for pregelatinizing the resultant barley grains to the specified degree by steaming them at =105 deg.C, a drying step 5 for drying the thus steamed barley grains to such a moisture content as to be polishable, a post-pregelatinization barley polishing step 6 for polishing the thus dried barley grains until the albumen is exposed, and a heating step 7 for exposing the resultant barley grains to hot air at 105-300 deg.C to promote their pregelatinization and concurrently drying them to a moisture content of =13 wt.%.
机译:要解决的问题:提供一种出色的方法来抑制大麦粉的预糊化,方法是通过预糊化,抛光和干燥(即整个生产过程)中的一系列过程产生的压碎颗粒来抑制因原料造成的粘性和产量下降用于预糊化的大麦与米粉混合煮沸后食用,或多孔的预糊化的大麦作为味mis(酱油)或烧酒(蒸馏酒)的原料。解决方案:该方法包括以下步骤:预预糊化大麦抛光步骤2,用于将生大麦抛光至离开种子皮以获得大麦籽粒的程度;加水步骤3,用于向如此抛光的大麦籽粒中添加水。这样的水含量可预糊化至特定程度,通过在<= 105℃下蒸煮以将所得的大麦籽粒预糊化至特定程度的蒸煮步骤4,用于将如此蒸过的大麦籽粒干燥至这样的水分含量可以被抛光,预糊化后的大麦抛光步骤6用于抛光如此干燥的大麦籽粒直到蛋白被暴露,加热步骤7用于将所得的大麦籽粒在105-300度的温度下暴露于热空气中。 C以促进它们的预胶凝并同时干燥至水分含量≤13重量%。

著录项

  • 公开/公告号JP4189785B2

    专利类型

  • 公开/公告日2008-12-03

    原文格式PDF

  • 申请/专利权人 株式会社サタケ;

    申请/专利号JP20000153485

  • 发明设计人 渡辺 健吾;佐竹 覺;前原 裕之;

    申请日2000-05-24

  • 分类号A23L1/10;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:20

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