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PROCESSING CONDITION INSPECTION AND OPTIMIZATION METHOD OF DAMAGE RECOVERY PROCESS, DAMAGE RECOVERING SYSTEM AND STORAGE MEDIUM

机译:损伤修复过程,损伤修复系统和存储介质的加工条件检查及优化方法

摘要

A processing condition inspection method of a damage recovery process for reforming a film having OH groups generated by damages from a predetermined process by using a processing gas includes preparing a substrate having an OH group containing resin film, measuring an initial film thickness of the OH group containing resin film, performing a damage recovery process on the substrate after measuring the initial film thickness, measuring a film thickness of the OH group containing resin film after the damage recovery process, calculating a film thickness difference of the OH group containing resin film before and after the damage recovery process, and determining whether processing conditions of the damage recovery process are appropriate or inappropriate based on the film thickness difference.
机译:用于通过使用处理气体来重整由预定过程中的损伤产生的具有OH基的膜的损伤恢复过程的处理条件检查方法,该方法包括制备具有含OH基的树脂膜的基板,测量该OH基的初始膜厚在测量初始膜厚之后,在基底上进行损伤恢复处理,在损伤恢复处理后,测量含OH基树脂膜的膜厚,计算之前和之后的含OH基树脂膜的膜厚差。在损伤恢复处理之后,根据膜厚差判断损伤恢复处理的处理条件是否适当。

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