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Leadframe Design for QFN Package with Top Terminal Leads
Leadframe Design for QFN Package with Top Terminal Leads
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机译:具有顶部终端引线的QFN封装的引线框架设计
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摘要
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
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