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CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX
CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX
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机译:用于清除无铅焊剂的清洁剂组合物,用于清除无铅焊剂的清洗剂以及用于清除无铅焊剂的方法
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摘要
The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains:(A) a polyoxyalkylene phosphate-based surfactant,(B) a metal chelating agent, and(C) a halogen-free organic solvent;and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by; MaHb(CO3)C General Formula (7);where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.
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机译:本发明提供了一种清洁剂组合物,其可以令人满意地除去附着在待清洁物体上的无铅助焊剂,对环境的影响很小,并且具有气味,可燃性等,在实用范围内是可以接受的。漂洗剂,用于在用清洗剂组合物清洗后清洗被清洗物,以更有效地去除无铅助焊剂;以及使用该组合物(和漂洗剂)的去除方法。用于去除无铅助焊剂的清洁剂组合物包含:(A)一种基于聚氧化烯的表面活性剂, ListItem> (B)一种金属螯合剂, ListItem> (C)无卤有机溶剂; ListItem> ,以及用于去除铅的漂洗剂-无助焊剂包含由 ListItem> UnorderedList> ListItem> UnorderedList>表示的碳酸盐; <?in-line-formulae description =“ In-line Formulae” end =“ lead”?> M a Sub> H b Sub>(CO 3 Sub> ) C Sub>通式(7)<?in-line-formulae description =“ In-line Formulae” end =“ tail”?>;其中a是1或2的整数。 0到2的整数,c是1或2的整数,M是挥发性有机碱。
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