−0.0068S+2.548≦α1≦−0.0068S+3.748 (1)−0.0011S+1.158≦α2≦−0.0011S+2.058 (2)wherein S is a BET specific surface area (m2/g) of the fine silica particles,in the measurement of small-angle X-ray scattering. When used as a filler for a semiconductor-encapsulation resin or when used as a filler for a polishing agent or for a coating layer for ink jet papers, the fine silica particles are available at high content without substantial enhancement of the viscosity. Besides, when used as a filler for the resin, the fine silica particles improve the strength of the molding compound. Furthermore, when used as a toner additive for electrophotography, the fine silica particles improve the free-flow property of the toner without removal from the toner surfaces."/>
Fine silica particles having specific fractal structure parameter
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Fine silica particles having specific fractal structure parameter
Fine silica particles having specific fractal structure parameter
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机译：具有特定分形结构参数的二氧化硅细颗粒
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摘要
This invention provides flame-generated fine silica particles having an average particle size of 0.05 to 1 μm, wherein a fractal structure parameter α1 at length scales ranging from 50 nm to 150 nm and a fractal structure parameter α2 at length scales ranging from 150 nm to 353 nm satisfy the following formulas (1) and (2):−0.0068S+2.548≦α1≦−0.0068S+3.748 (1)−0.0011S+1.158≦α2≦−0.0011S+2.058 (2)wherein S is a BET specific surface area (m2/g) of the fine silica particles,in the measurement of small-angle X-ray scattering. When used as a filler for a semiconductor-encapsulation resin or when used as a filler for a polishing agent or for a coating layer for ink jet papers, the fine silica particles are available at high content without substantial enhancement of the viscosity. Besides, when used as a filler for the resin, the fine silica particles improve the strength of the molding compound. Furthermore, when used as a toner additive for electrophotography, the fine silica particles improve the free-flow property of the toner without removal from the toner surfaces.展开▼
机译：本发明提供了平均粒径为0.05〜1μm的火焰产生的二氧化硅微粉，其分形结构参数α 1 的长度范围为50nm〜150nm，分形结构参数α 2 的长度范围为150 nm至353 nm，满足以下公式（1）和（2）：<？in-line-formulae description =“在线公式” end =“ lead”？> − 0.0068 S + 2.548≦α 1 ≦−0.0068 S +3.748（1）<？in-line-formulae description =“ In-line Formulae” end =“ tail”？> <？in-line-formulae description =“ In-line Formulae” end =“ Lead“？>-0.0011 S + 1.158≦α 2 ≦−0.0011 S +2.058（2）<？ =“在线公式” end =“ tail”？> 其中S是二氧化硅细颗粒的BET比表面积（m 2 / g），在小角度X射线散射的测量中。当用作半导体封装树脂的填料或用作抛光剂的填料或喷墨纸的涂层的填料时，二氧化硅细颗粒可以高含量获得，而粘度没有显着提高。此外，当用作树脂的填料时，二氧化硅细颗粒提高了模塑料的强度。此外，当用作电子照相用调色剂添加剂时，二氧化硅细颗粒改善了调色剂的自由流动性，而没有从调色剂表面除去。
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