首页> 外国专利> SOLVENT-FREE, ROOM TEMPERATURE CURING REACTIVE SYSTEMS AND THE USE THEREOF IN THE PRODUCTION OF ADHESIVES, SEALING AGENTS, CASTING COMPOUNDS, MOLDED ARTICLES OR COATINGS

SOLVENT-FREE, ROOM TEMPERATURE CURING REACTIVE SYSTEMS AND THE USE THEREOF IN THE PRODUCTION OF ADHESIVES, SEALING AGENTS, CASTING COMPOUNDS, MOLDED ARTICLES OR COATINGS

机译:无溶剂,室温的反应活性体系及其在生产粘合剂,密封剂,铸造化合物,模制品或涂层中的用途

摘要

The present invention relates to novel solventless reactive systems curable atroomtemperature, based on blocked polyisocyanates, primary amines, compounds withoxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and toprocesses forthe preparation of these solventless reactive systems curable at roomtemperature.
机译:本发明涉及可在室温下固化的新型无溶剂反应体系。房间温度,基于封端的多异氰酸酯,伯胺,环氧乙烷基团和2,3-二甲基-3,4,5,6-四氢嘧啶和流程这些可在室温固化的无溶剂反应体系的制备温度。

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