首页> 外国专利> STYRENE-MODIFIED PARTICLE OF LINEAR LOW-DENSITY POLYETHYLENE RESIN, EXPANDABLE STYRENE-MODIFIED PARTICLE OF LINEAR LOW-DENSITY POLYETHYLENE RESIN, PROCESSES FOR PRODUCING THESE, PRE-EXPANDED PARTICLE, AND MOLDED FOAM

STYRENE-MODIFIED PARTICLE OF LINEAR LOW-DENSITY POLYETHYLENE RESIN, EXPANDABLE STYRENE-MODIFIED PARTICLE OF LINEAR LOW-DENSITY POLYETHYLENE RESIN, PROCESSES FOR PRODUCING THESE, PRE-EXPANDED PARTICLE, AND MOLDED FOAM

机译:线性低密度聚乙烯树脂的苯乙烯改性颗粒,线性低密度聚乙烯树脂的苯乙烯改性颗粒,制备这些过程,预发泡颗粒和模制泡沫

摘要

A method for producing styrene-modified linear low-density polyethylene-based resin beads, which includes the steps of: dispersing 100 parts by weight of non-crosslinked linear low-density polyethylene-based resin beads which are polymerized using a metallocene compound as a catalyst and contain an inorganic nucleating agent, 50 to 800 parts by weight of a styrene-based monomer and 0.1 to 0.9 parts by weight of a polymerization initiator relative to 100 parts by weight of the styrene-based monomer into an aqueous suspension containing a dispersant; impregnating the polyethylene-based resin beads with the styrene-based monomer under heating the resulting dispersion at such a temperature that the styrene-based monomer does not substantially polymerize; and performing polymerization of the styrene-based monomer at a temperature of (T + 10) to (T + 35)°C where T°C is a crystallization peak temperature of the polyethylene-based resin beads.
机译:一种生产苯乙烯改性的线性低密度聚乙烯基树脂珠的方法,该方法包括以下步骤:分散100重量份的使用茂金属化合物作为聚合物的非交联的线性低密度聚乙烯基树脂珠。相对于100重量份苯乙烯基单体,该催化剂含有无机成核剂,相对于100重量份苯乙烯基单体为50至800重量份的苯乙烯基单体和0.1至0.9重量份的聚合引发剂。 ;在使所得分散体在苯乙烯基单体基本上不聚合的温度下,在加热所得分散体的情况下用苯乙烯基单体浸渍聚乙烯基树脂珠。在(T + 10)至(T + 35)℃的温度下进行苯乙烯基单体的聚合,其中T℃是聚乙烯基树脂珠粒的结晶峰温度。

著录项

  • 公开/公告号EP1803752A4

    专利类型

  • 公开/公告日2009-10-21

    原文格式PDF

  • 申请/专利权人 SEKISUI PLASTICS CO. LTD.;

    申请/专利号EP20050772811

  • 发明设计人 MATSUMURA HIDEYASU;MATSUGASHITA TATSUYA;

    申请日2005-08-19

  • 分类号C08F255/02;C08F285;C08J9/18;C08L23;

  • 国家 EP

  • 入库时间 2022-08-21 19:17:43

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