首页> 外国专利> METHOD FOR PRODUCING conductive panels charge RESOURCES FOR MANUFACTURING PANELS AND GANG GANG FILLER BASED grinding crystallized GLASSES FOR THEM

METHOD FOR PRODUCING conductive panels charge RESOURCES FOR MANUFACTURING PANELS AND GANG GANG FILLER BASED grinding crystallized GLASSES FOR THEM

机译:导电板的生产方法,制造面板的电荷资源以及基于岗岗填料的研磨结晶玻璃

摘要

1. A method of manufacturing conductive panels, electrically conductive component comprising mixing - coke with a particle size of 0.2-1.5 mm with a binder, molding and subsequent heat treatment, characterized in that the ground clay component used as the binder component, consisting of a conductive material is further ground using graphite, silicon carbide, and the conductive filler in the form of granules of 0.1-1.0 mm obtained from co-milled mixture, wt.%: calcium carbonate 01.06, Graphite 8-11, 6-10 silicon carbide, a powder of the crystallized glass and 8-12, 73-85% aqueous solution of sodium silicate 1-3% over 100 the following ratio of the charge of the conductive material, wt.%: wherein before molding moistened raw batch to a moisture content of 4-7%, molding is carried out dry pressing method, a heat treatment is carried out in a weak oxidizing atmosphere at a temperature of 880-910 ° C.2. Raw material charge for the production of conductive panels, electrically conductive component comprising - coal coke having a particle size of 0.2-1.5 mm and a binder, characterized in that the blend as a binder component comprises a powder clayey component in the composition of the conductive material additionally comprises milled graphite , silicon carbide, and the conductive filler in the form of granules of 0.1-1.0 mm, consisting of a powdered mixture, wt.%: 1-6 calcium carbonate, graphite, 8-11, 6-10 silicon carbide, crystallized glass powder 73- 85 and 8-12% aqueous solution of sodium silicate in excess of 100% 1-3 in the following ratio of the charge, wt.%: 3. The conductive fill
机译:1。一种制造导电板,导电部件的方法,包括将颗粒尺寸为0.2-1.5mm的焦炭与粘合剂混合,模制和随后的热处理,其特征在于,用作粘合剂组分的磨碎的粘土组分包括:使用石墨,碳化硅和由共研磨混合物制得的0.1-1.0毫米颗粒形式的导电填料进一步研磨导电材料,重量百分比:碳酸钙01.06,石墨8-11、6-10硅碳化物,微晶玻璃粉末和硅酸钠8-12、73-85%硅酸钠水溶液1-3%(相对于100下列导电材料的电荷比率),wt。%:水分含量为4-7%,通过干压法成型,在弱氧化气氛中在880-910℃的温度下进行热处理。2。用于生产导电板的原料装料,包括-粒径为0.2-1.5 mm的煤焦炭和粘结剂的导电组分,其特征在于,作为粘结剂组分的共混物在导电剂的组成中包括粉末黏土组分该材料还包含研磨的石墨,碳化硅和0.1-1.0毫米颗粒形式的导电填料,其由粉末混合物组成,重量百分比:1-6碳酸钙,石墨,8-11、6-10硅碳化物,结晶玻璃粉末73- 85和8-12%的硅酸钠水溶液,其含量超过100%1-3,以下电荷比率(重量%):3.导电填料

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