Component and structural system comprises hydrophobic microporous thermal insulation, where thermal insulating material is micro-porous thermal insulating material, which is injected or compressed without binders to plates or molded parts

摘要

The component and structural system comprises hydrophobic microporous thermal insulation. The thermal insulating material is micro-porous thermal insulating material, which is injected or compressed without binders to plates or molded parts, and is shifted before shaping with organosilane. The microporous thermal insulating material comprises 5-98, preferably 50-92 wt.% of pyrogene silicic acid or silicon dioxide aerogels, 3-40, preferably 5-20 wt.% of an opacifier, 0-20, preferably 1-8 wt.% of fibers, and 0-65, preferably 10-40 wt.% of inorganic additives. The organosilane has general formula (I or II). R n-Si-X (4-n) R 3Si-Y-SiR 3 n : 1, 2 or 3; Y : NH or O; R 3-CH, -C 2H 5 or H; X : Cl, Br, -OCH 3, -OC 2H 5 or -OC 3H 8. An independent claim is also included for a method for manufacturing the component, which involves manufacturing a single-shell or two-shell component with vertical holes, in assembled condition.