Carrier structure for electronic power component e.g. semiconductor component such as diode, has fixed connection existing between base plate and carrier layer, where connection is frictional, form-fitting or material closure connection

摘要

The structure has a base plate (3) and an electrically isolating carrier layer (4) directly connected to each other such that a plate top side (10) and a layer bottom side (11) are directly joined together. The layer has a carrier layer top side (12) serving as basis for assembly of a component (6) in an electronic power component (1). A fixed connection exists between the plate and the layer, where the connection is selected from the group of frictional connection, form-fitting connection or material closure connection. The layer consists of ceramic-containing material or plastic. An independent claim is also included for a method for producing a carrier structure for an electronic power component.