Reactive resin system useful for encapsulating electronic or electrical components comprises an epoxy resin based on a monomer with three epoxy groups and an epoxy resin based on a monomer with at least four epoxy groups

摘要

Reactive resin system comprises an epoxy resin (I) based on a monomer with three epoxy groups and an epoxy resin (II) based on a monomer with at least four epoxy groups.