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Distance transducer, the manufacturing method of the distance transducer and test card, which contains the distance transducer

机译:距离传感器,包括距离传感器的距离传感器和测试卡的制造方法

摘要

Test card of a semiconductor - test device, comprising:a printed circuit board, on the outside of an electrical signal is applied;a distance transducer with a plurality of test needles which are directly in contact with a test object; and connecting lines, which the printed circuit board with the test needles of the distance transducer connect,the distance transducer comprises: substrate components, on one of its sides, the test needles are mounted; and a linking element, the components of the substrate is combined with one another and in order, with the substrate components in the same plane to form a larger areas - substrate.
机译:半导体测试装置的测试卡,包括:在电信号的外部施加印刷电路板;具有多个与测试对象直接接触的测试针的距离传感器;距离传感器包括:基板部件,在其一侧上安装有测试针;以及连接线,印刷电路板与距离传感器的测试针连接。以及连接元件,将基板的各组件彼此组合在一起,并且使基板的各组件在同一平面上以形成较大的区域-基板。

著录项

  • 公开/公告号DE112007000389T5

    专利类型

  • 公开/公告日2008-12-11

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20071100389T

  • 发明设计人

    申请日2007-02-13

  • 分类号H01L21/66;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:24

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