首页>
外国专利>
Test structure for highly accelerated electromigration tests for thick metallization systems of solid bodies
Test structure for highly accelerated electromigration tests for thick metallization systems of solid bodies
展开▼
机译:用于固体厚金属化系统的高度加速电迁移测试的测试结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a test structure and a method for highly accelerated electromigration tests of integrated circuits, wherein metallization planes consisting of conductor tracks of ordinary thickness (11) are connected to metallization planes consisting of conductor tracks which are substantially thicker (12) as required for connecting high-performance components.
展开▼