Optoelectronic component has base body and two light-emitting semiconductor chips arranged on two non-parallel surfaces of base body, where base body has metallization for supplying power to light-emitting semiconductor chips

摘要

The optoelectronic component has a base body (1) and two light-emitting semiconductor chips (4a,4b) arranged on two non-parallel surfaces (3a,3b) of the base body. The base body has a metallization for supplying power to the light-emitting semiconductor chips. Connection elements (7) are provided for connection of the component. An independent claim is included for an optoelectronic component manufacturing method.