NON-CYANIDE ELECTROLESS GOLD PLATING SOLUTION AND PLATING METHOD OF CONDUCTOR PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a plating solution and a plating method of electroless gold plating for plating a conductor pattern to be formed on a conductor pattern made of copper or aluminum formed on a printed circuit board or a wafer, in which a gold film is directly deposited by autocatalytic reduction reaction without performing immersion gold plating treatment on an electroless palladium plating film formed on the conductor pattern.;SOLUTION: There is used a plating solution containing a predetermined concentration of a non-cyanide gold sulfite, a sulfite, a thiosulfate, a water-soluble polyamino-carboxylic acid, a benzotriazole compound, an amino acid compound containing sulfur, and hydroquinone.;COPYRIGHT: (C)2010,JPO&INPIT