ELECTROLESS PLATING METHOD OF POLYIMIDE RESIN BASE MATERIAL, POLYIMIDE RESIN BASE MATERIAL ELECTROLESSLY PLATED BY THE METHOD, DISPERSION LIQUID, AND METHOD OF MANUFACTURING THE DISPERSION LIQUID

摘要

PROBLEM TO BE SOLVED: To form a conductive film excellent in adhesiveness, easily at a low cost, on a polyimide resin base.;SOLUTION: By bringing a part of a polyimide resin base, which is to be plated, into contact with an alkaline solution, a treatment to open the imide ring of the polyimide resin base material of the part to be plated is performed. Thereafter, the polyimide resin base material is immersed in an acidic dispersion liquid in which metal fine particles provided with coated film made of a polymer having polypyrrole main chain are dispersed. By the immersion, the metal fine particles having the coated film are attached to the part to be plated of the polyimide resin base material. Subsequently, the polyimide resin base material in which the metal fine particles having the coated film are attached to the part to be plated is heated at such a temperature that at least the coated film and the metal fine particle are fused. Then, an electroless plating film is deposited on the part to be plated of the heated polyimide resin base.;COPYRIGHT: (C)2010,JPO&INPIT