PROBLEM TO BE SOLVED: To calculate an optimum plating thickness in a short time.;SOLUTION: In a semiconductor integrated circuit manufacturing process that is executed in the order of a plating process, a polishing process, and an overpolishing process, the shaved conductor thickness of the conductor that is shaved off by the overpolishing process is calculated by using the polishing time and the polishing speed at the time of the overpolishing process. Until a remaining conductor thickness that is expected to remain at a place except a wiring groove on a substrate after the polishing process becomes the shaved conductor thickness or less, the plating thickness of the conductor that is plated on the substrate by the plating process is changed. The simulation ranging from the plating process to the polishing process is repeatedly executed in order to obtain the remaining conductor thickness.;COPYRIGHT: (C)2010,JPO&INPIT
展开▼
