In the board cooling structure of the dipping liquid cooling die where the exoergic element is implemented by

摘要

PROBLEM TO BE SOLVED: To provide an immersion liquid type board structure capable of performing prescribed cooling intending a board mounting a high power consumption IC and provide a semiconductor device using it.;SOLUTION: The immersion liquid cooling board cooling structure is provided with a blocking means for circulating and preventing a medium between both boards to a through hole being the formation of a non-intended cooling flow passage existing in an immersion liquid cooling part on the board.;COPYRIGHT: (C)2002,JPO