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Extreme Temperature Robust Optical Sensor Designs And Fault-Tolerant Signal Processing

机译:极端温度稳健的光学传感器设计和容错信号处理

摘要

Silicon Carbide (SiC) probe designs for extreme temperature and pressure sensing uses a single crystal SiC optical chip encased in a sintered SiC material probe. The SiC chip may be protected for high temperature only use or exposed for both temperature and pressure sensing. Hybrid signal processing techniques allow fault-tolerant extreme temperature sensing. Wavelength peak-to-peak (or null-to-null) collective spectrum spread measurement to detect wavelength peak/null shift measurement forms a coarse-fine temperature measurement using broadband spectrum monitoring. The SiC probe frontend acts as a stable emissivity Black-body radiator and monitoring the shift in radiation spectrum enables a pyrometer. This application combines all-SiC pyrometry with thick SiC etalon laser interferometry within a free-spectral range to form a coarse-fine temperature measurement sensor. RF notch filtering techniques improve the sensitivity of the temperature measurement where fine spectral shift or spectrum measurements are needed to deduce temperature.
机译:用于极端温度和压力感测的碳化硅(SiC)探头设计使用封装在烧结SiC材料探头中的单晶SiC光学芯片。 SiC芯片仅可用于高温保护,也可暴露在温度和压力感测下。混合信号处理技术允许容错的极端温度感测。波长峰-峰(或从零到零)的集体频谱扩展测量可检测波长峰/零位移测量,从而形成使用宽带频谱监视的粗精细温度测量。 SiC探头前端可充当稳定的发射率黑体辐射器,并且监测辐射光谱的变化即可使用高温计。此应用程序在自由光谱范围内将全SiC高温测定与厚SiC标准具激光干涉法相结合,形成了粗细温度测量传感器。射频陷波滤波技术可提高温度测量的灵敏度,其中需要精细的频谱偏移或频谱测量来推断温度。

著录项

  • 公开/公告号US2009296776A1

    专利类型

  • 公开/公告日2009-12-03

    原文格式PDF

  • 申请/专利权人 NABEEL AGHA RIZA;FRANK PEREZ;

    申请/专利号US20090468359

  • 发明设计人 FRANK PEREZ;NABEEL AGHA RIZA;

    申请日2009-05-19

  • 分类号G01J5/00;

  • 国家 US

  • 入库时间 2022-08-21 18:51:37

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