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Method for Treatment of Samples for Auger Electronic Spectrometer (AES) in the Manufacture of Integrated Circuits
Method for Treatment of Samples for Auger Electronic Spectrometer (AES) in the Manufacture of Integrated Circuits
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机译:集成电路制造中俄歇电子能谱仪(AES)的样品处理方法
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摘要
A method for analyzing a sample for the manufacture of integrated circuits, e.g. MOS transistors, application specific integrated circuits, memory devices, microprocessors, system on a chip. The method includes providing an integrated circuit chip, which has a surface area with at least one region of interest, e.g., bond pad. The method includes covering a first portion of the surface area including the region of interest using a blocking material. The method also forms a metal layer on a second portion of the surface area, while the blocking material protects the first portion. The method removes the blocking material to expose the first portion of the surface area including the region of interest. The method also subjects the metal layer to a voltage differential to draw away one or more charged particles from the first portion of the surface area. The method also subjects the surface area including the region of interest to spectrometer analysis.
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