MULTI-SENSOR STACKED 3D DEVICE FOR STRUCTURALLY CONTROLLING AN ACTIVE

摘要

The invention relates to a multi-sensor stacked 3D device for structurally controlling an active. According to the invention, the device consists of a casing, a packed sub-layer (8A) comprising many electrically conductive plates on at least a surface and many chips (20A, 20B), in a vertically stacked arrangement inside the casing, the chips (20A, 20B) being intercalated with and fixed on the packed sub-layer (8A) so that a first part of the electrically conductive plates is electrically coupled and superposed on a second part pair of electrically conductive plates of a chip, and wherein at least a chip comprises a sensor coupled with at least an electrically conductive plate of the mentioned chip.