METHOD AND APPARATUS FOR OPTIMIZING THERMAL MANAGEMENT SYSTEM PERFORMANCE USING FULL-CHIP THERMAL ANALYSIS OF SEMICONDUCTOR CHIP DESIGNS

摘要

A method and apparatus for optimizing cooling system performance using full-chip thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for optimizing the cooling of an electronic system incorporating at least one semiconductor chip includes receiving full-chip temperature data for the semiconductor chip(s) and configuring the cooling system for dissipating heat from the electronic system in accordance with the full-chip temperature data.