A leadframe is provided with, on a same flat surface, a pad section (2) which has an LED chip mounting front surface (A) having an LED chip mounted thereon and is arranged on one or a plurality of areas, and a lead section (2a) having an electrically connecting area (C) which performs electrical connection with the LED chip. The relationship between an area (S1) of the pad sections on the mounting front surface and an area (S2) of a heat dissipating rear surface (B) which faces the mounting front surface satisfies inequalities of 0S1S2. The leadframe has, on a side surface section of the pad section between the mounting front surface and the heat dissipating rear surface, a step-shaped section or a taper-shaped section (E) which widens from the mounting front surface toward the heat dissipating rear surface and holds a resin applied when molding is performed.
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