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DEPOSITION APPARATUS OF SOLID POWDER WHICH IS EQUIPPED WITH A THERMAL SHOCK CONTROL UNIT AND A TEMPERATURE CONTROL METHOD FOR ELIMINATING THE THERMAL SHOCK IN A SOLID POWDER SPRAY DEPOSITION, CAPABLE OF ENABLING THE DEPOSITION WITHOUT THERMAL SHOCK, PHASE TRANSFORMATION, AND A DIMPLE
DEPOSITION APPARATUS OF SOLID POWDER WHICH IS EQUIPPED WITH A THERMAL SHOCK CONTROL UNIT AND A TEMPERATURE CONTROL METHOD FOR ELIMINATING THE THERMAL SHOCK IN A SOLID POWDER SPRAY DEPOSITION, CAPABLE OF ENABLING THE DEPOSITION WITHOUT THERMAL SHOCK, PHASE TRANSFORMATION, AND A DIMPLE
PURPOSE: A deposition apparatus of solid powder equipped with a thermal shock control unit and a temperature control method for eliminating the thermal shock in a solid powder spray deposition are provided to deposit and spray the solid powder without the thermal shock to a material by controlling the temperatures of heating and cooling the solid powder.;CONSTITUTION: A deposition apparatus of solid powder which is equipped with a thermal shock control unit comprises: a spray deposition unit in which carrier gas is discharged through a supersonic nozzle and a subsonic nozzle; a heating unit supervising the control of a heating temperature of the carrier gas; and a cooling unit which is arranged to make the solid powder pass through the cooling unit before supplying the carrier gas and supervises the control of a cooling temperature of the solid powder.;COPYRIGHT KIPO 2010
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