MULTI FUNCTIONAL MULTI CHIP PACKAGE STRUCTURE OF A PACKAGE-ON-PACKAGE TYPE, CAPABLE OF SIMULTANEOUSLY INCREASING THE CAPACITY OF AN ELECTRIC DEVICE AND MINIMIZING A MOUNT AREA

摘要

PURPOSE: A multi functional multi chip package structure of a package-on-package type is provided to implement a package stack structure of a package-on-package type by mounting a multi chip package to perform a high speed image process function on a memory package with high capacity.;CONSTITUTION: A plurality of memory semiconductor chips(120) is vertically stacked on a PCB substrate(110) using a chip-on-chip method. The semiconductor chips are electrically connected to each other by bonding with a PCB substrate using a wire(140). The semiconductor chip is electrically connected to the outside by a solder ball(150). The solder ball is bonded with a ball land of a lower PCB substrate(210). A protection member(160) is molded on the substrate to protect the semiconductor chip and the wire.;COPYRIGHT KIPO 2010