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SEMICONDUCTOR DEVICE OF COMMON SOURCE STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE OF COMMON SOURCE STRUCTURE

机译:共源结构的半导体装置及共源结构的制造方法

摘要

PURPOSE: A semiconductor device of common source structure and a manufacturing method of the semiconductor device of the common source structure are provided to prevent loss of the semiconductor substrate and opening of the common source by realizing the common source of poly-line shape. CONSTITUTION: A gate line having a floating gate(120) of line-shape, a dielectric layer(125), and a control gate(130) is formed on a semiconductor substrate(100). A first insulation layer is formed on the semiconductor substrate including the gate line. A liner trench is formed to expose semiconductor substrate between the gate lines. A common source(180) is formed in the trench.
机译:目的:提供一种具有公共源极结构的半导体器件及其制造方法,以通过实现多线形状的公共源极来防止半导体衬底的损失和公共源极的开口。构成:具有线状浮栅(120),介电层(125)和控制栅(130)的栅线形成在半导体衬底(100)上。在包括栅极线的半导体衬底上形成第一绝缘层。形成衬层沟槽以暴露栅极线之间的半导体衬底。在沟槽中形成公共源(180)。

著录项

  • 公开/公告号KR20100072851A

    专利类型

  • 公开/公告日2010-07-01

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080131379

  • 发明设计人 KIM NAM YOON;

    申请日2008-12-22

  • 分类号H01L27/115;H01L21/8247;H01L29/788;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:22

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