首页> 外国专利> A method for operating a chemically - mechanical polishing system by means of a sensor signal of a polishing pad position ierers conditioned

A method for operating a chemically - mechanical polishing system by means of a sensor signal of a polishing pad position ierers conditioned

机译:一种通过调节的抛光垫位置的传感器信号来操作化学机械抛光系统的方法

摘要

A method for operating a cmp - system with:a movable and actuable polishing head (104), which is formed, a substrate (107) in position to receive and to keep;a polishing pad (102) which, on a plate (101) is mounted, which can be connected to a first drive arrangement (103) is coupled;a pad conditioning arrangement (110) which, with a second drive arrangement (112) is connected; anda control unit (120) operatively associated with the polishing head (104) and the first and second drive arrangement (103, 112) is connected, wherein the control unit (120) is formed, the operation of the first and second drive arrangement (103, 112), and wherein the controller (120) is further designed in the case of reception of a sensor signal (124) of the second drive arrangement (112) an indication of at least one property of a consumption component of the system (100) to provide,the method comprising:Conditioning of the polishing pad during the polishing of the substrate;Estimating a state of a cushion position conditioned ierers (110) on the basis of the..
机译:一种用于操作CMP系统的方法,该系统具有:形成的可移动和可启动的抛光头(104),处于接收和保持位置的衬底(107);抛光垫(102),其位于板(101)上)安装有可连接至第一驱动装置(103)的垫;垫调节装置(110),其与第二驱动装置(112)连接;可操作地与抛光头(104)相关联的控制单元(120)和第一和第二驱动装置(103、112)相连,其中形成控制单元(120),第一和第二驱动装置( 103、112),其中,在接收到第二驱动装置(112)的传感器信号(124)的情况下,还进一步设计控制器(120),该信号指示系统的消耗组件的至少一个属性( 100)提供,该方法包括:在衬底的抛光过程中对抛光垫进行调节;基于该条件估计缓冲位置的状态(110)。

著录项

  • 公开/公告号DE10324429B4

    专利类型

  • 公开/公告日2010-08-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE2003124429

  • 发明设计人

    申请日2003-05-28

  • 分类号B24B37/04;B24B37/00;B24B53/00;

  • 国家 DE

  • 入库时间 2022-08-21 18:29:11

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